Cyber Cloud Technologies LLC

Assembly Engineer

US-MD-Fort Meade
8 months ago
ID
2017-1126
# of Openings
1
Category
Information Technology

Overview

The candidate will be responsible for developing processes, procedures, fixtures, and tooling to support the assembly of custom electronic modules and PCBs.

Responsibilities

  • Developing unique solutions to challenging Microelectronic packaging and assembly problems
  • Ensuring processes and tools are configured to comply with customer product specifications in a microelectronics assembly operation
  • Qualifying and testing new assembly processes working with assembly operators, technicians, and customer engineers
  • Identifying and procuring lab supplies and production materials
  • Working with Engineers to reduce scrap and improve yield in production operations
  • Developing processes and tools to support prototype quantities and full scale production
  • Researching and adapting new electronic packaging techniques to solve tough assembly problems

Qualifications

  • Active TS/SCI with Polygraph required (does not accept CCA candidate)
  • Bachelor’s Degree in an appropriate technical discipline, e.g., Electrical, Chemical, Mechanical, Materials or Microelectronic Engineering, Chemistry or Physics

Preferred Additional Skills:

  • Master’s Degree in an appropriate technical discipline, e.g., Electrical, Chemical, Mechanical, Materials or Microelectronic Engineering, Chemistry or Physics
  • Internships in any of the following areas are a plus;
  • Experience with Microelectronic packaging processes and/or Printed Circuit Board (PCB) / Surface Mount Technology (SMT) assembly processes
  • Experience in designing and qualifying assembly procedures
  • Experience in setting up process equipment and qualifying production processes
  • Experience with microelectronic assembly techniques including mechanical and chemical processes
  • Ability to research and adapt new packaging techniques to solve tough assembly problems

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